PURPOSE:
The purpose of this course / tutorial is to provide a concise overview
of methods by which microcapsules are formed, their properties, and applications.
Current trends and recent literature in microcapsule design and development
will be emphasized.
INTENDED
AUDIENCE:
This program is intended for physical and life sciences personnel interested
in microencapsulation. Topics are interdisciplinary in nature and therefore
of interest to members of a variety of technical fields.
LECTURER:
Dr. Thies taught polymer, surface, colloid, and materials sciences courses
at Washington University in St. Louis for 29 years. He was chosen Engineering
Professor of the Year four times by Washington University engineering
students. He was head of the Polymer/Microencapsulation Research Section
at NCR in Dayton, Ohio for seven years. He has lectured globally about
microcapsules at numerous seminars and published extensively on the subject.
Topics discussed in the tutorial/update are drawn from extensive original
analyses of microcapsule patent and journal literature, as well as accumulated
laboratory experience. The lectures are designed to present a timely overview
of current understanding of how microcapsules are formed, their properties
and how they can be used.
PRESENTATION:
Power Point with hard copies provided in bound course note form. Each
attendee will receive a set of detailed course notes that contain numerous
current references.
COURSE ITINERARY: HOTEL
SUGGESTIONS:
Day One
9:00 AM:
Introduction to microcapsule structures/properties
10:15 AM:
Break
10:30 AM:
Concise review of current encapsulation technologies
12:00 PM:
Lunch
1:30 PM:
New/novel encapsulation technology developments
2:45 PM:
Microcapsule shell materials and process selection considerations
3:30 PM:
Break
3:45 PM:
Microcapsule characterization studies
5:00 PM:
End of Day One
Day Two
8:30 AM:
Microcapsule applications. Part I. (Biological sciences)
10:15 AM:
Break
10:30 AM:
Microcapsule applications. Part II. (Consumer products)
12:00 PM:
Lunch
1:30 PM:
Microcapsule applications. Part III. (Industrial products)
3:00 PM:
Break
3:15 PM:
Problems and unresolved microcapsule issues
4:15 PM:
Overall summary
4:45 PM:
End of Day Two
NOTE: All microcapsule application sessions will include comercial case studies. Complete course notes will be provided to each attendee.
LOCATION:
Thies Technology
921 American Pacific Dr.
Suite 309
Henderson, NV 89014
Telephone: (702) 567-8206
Hampton Inn and Suites- Henderson
and
Holiday Inn Express-Henderson
Thies Technology